Types of USB Flash Drive Chips
The NAND flash memory
is the basis of countless consumer products. Given the ubiquity and their wide
range of applicability in time we have developed new solutions to reduce
production costs and simplify the production.
To date, the memory chip of a USB pendrive may be present in different formats with the same specifications.
These image are 4 among the most common versions of NAND chips used in a USB stick. From the right one of the most common, the version TSOP which generally has 48 pins arranged in 2 rows in the shorter sides. This is the first and most common type of chip, simple to produce, easy to assemble and possibly to be reviewed. Currently there are also versions to 56 feet (TSOP56) with equivalent specifications.
Then there was the appearance of the BGA (Ball Grid Array) . It is a surface mount chip but without any leg. The connection is through tin balls interposed between the PCB and the chip. This type of chip is able to achieve higher speeds, the absence of the legs and the direct connection to the PCB reduced to about one-third the distance between the memory array and the circuit. This type of chip is currently very well used in the telephone industry and SSD.
Very similar concept as is the LGA (Land Grid Array) that it does not have legs and solder balls as the BGA. The pin is much more dense than BGA though often not all is used. The key specifications of this form factor is the ability to contain multiple stacked memory arrays. This allows to achieve remarkable capacity in a single chip. This type of chip is currently used in Apple products such as iPhone and iPad.
Last of all, the COB (Chip on Board) . It is a solution designed to minimize production processes and reduce costs to the maximum. In this case, the memory array is positioned on the PCB, added bonding and covered the whole with a resin similar to that used in the production of the normal chip. This version is in low-cost products such as USB Pendrive and economic SDcard. As this was the result of productions at low or very low cost quality it is clearly minimal. The possibility of intervening on this type of chip in the case of data recovery is very high because of the impossibility to remove it and the arrangement of the non-standard bonding which is incorporated into the molten resin.
To date, the memory chip of a USB pendrive may be present in different formats with the same specifications.
These image are 4 among the most common versions of NAND chips used in a USB stick. From the right one of the most common, the version TSOP which generally has 48 pins arranged in 2 rows in the shorter sides. This is the first and most common type of chip, simple to produce, easy to assemble and possibly to be reviewed. Currently there are also versions to 56 feet (TSOP56) with equivalent specifications.
Then there was the appearance of the BGA (Ball Grid Array) . It is a surface mount chip but without any leg. The connection is through tin balls interposed between the PCB and the chip. This type of chip is able to achieve higher speeds, the absence of the legs and the direct connection to the PCB reduced to about one-third the distance between the memory array and the circuit. This type of chip is currently very well used in the telephone industry and SSD.
Very similar concept as is the LGA (Land Grid Array) that it does not have legs and solder balls as the BGA. The pin is much more dense than BGA though often not all is used. The key specifications of this form factor is the ability to contain multiple stacked memory arrays. This allows to achieve remarkable capacity in a single chip. This type of chip is currently used in Apple products such as iPhone and iPad.
Last of all, the COB (Chip on Board) . It is a solution designed to minimize production processes and reduce costs to the maximum. In this case, the memory array is positioned on the PCB, added bonding and covered the whole with a resin similar to that used in the production of the normal chip. This version is in low-cost products such as USB Pendrive and economic SDcard. As this was the result of productions at low or very low cost quality it is clearly minimal. The possibility of intervening on this type of chip in the case of data recovery is very high because of the impossibility to remove it and the arrangement of the non-standard bonding which is incorporated into the molten resin.
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